China’s CXMT ships HBM3 to Huawei, eyes HBM3E by 2027
ChangXin Memory Technologies has delivered HBM3 samples to Huawei and other Chinese artificial intelligence companies as the country works to address memory shortages affecting chip manufacturing. The shipments mark a step toward full-scale production expected later this year, according to industry analysts cited by DigiTimes. CXMT trails global leaders by 3 to 4 years but maintains substantial manufacturing capacity of up to 280,000 wafers per month at its Chinese facilities.
The company plans to introduce HBM3E by 2027, when competitors will likely deploy HBM4 as the standard. CXMT has begun producing DDR5 memory modules with yield rates near 80 percent. The manufacturer expects to complete an initial public offering in early 2026, which could accelerate the development of advanced memory products for domestic customers such as Huawei and Cambricon, which face limited access to foreign technology.
