Micron unveils 192GB SOCAMM2 memory for AI systems
Micron Technology started distributing samples of its 192-gigabyte SOCAMM2 memory modules on Tuesday, October 22, 2025, from its Idaho headquarters. The new series uses 1-gamma LPDDR5X DRAM chips and provides 50 percent more storage than earlier SOCAMM products while cutting energy use by over 20 percent per chip. The modules reach 9600 megatransfers per second and target artificial intelligence systems and data centers that need high-capacity memory with lower power demands.
Testing with data center artificial intelligence applications showed the 192-gigabyte SOCAMM2 cut first-token latency by more than 80 percent, enabling faster response times. The Vera Rubin NVL144 rack system can hold six SOCAMM2 modules per CPU across 36 processors for more than 40 terabytes of total memory. Micron built the architecture to handle future artificial intelligence tasks that require larger, more efficient memory solutions.
