Samsung wins NVIDIA deal with blazing HBM4
Samsung has secured a key deal to supply NVIDIA with its next-generation HBM4 high-bandwidth memory, marking a significant milestone in the Korean company’s efforts to regain market share in the AI memory sector. The agreement comes as Samsung’s HBM4 modules achieve data transfer speeds of 11 gigabits per second—well above the JEDEC standard of 8 Gbps—and reportedly outpace offerings from rivals SK hynix and Micron.
Built using Samsung’s sixth-generation 10-nanometer-class DRAM and a 4-nanometer logic base die, the HBM4 chips deliver high bandwidth and improved energy efficiency, positioning them as critical components for NVIDIA’s upcoming Rubin AI platform. Facing stiff competition from AMD’s Instinct MI450 series, NVIDIA is prioritizing access to top-tier HBM4 solutions, and Samsung’s early technical lead has earned it a pivotal role in the supply chain.
The deal represents a turnaround for Samsung, which lagged behind competitors in HBM3 adoption over recent quarters. With this breakthrough, the company is reestablishing itself as a major player in the high-performance memory segment, likely prompting rivals to accelerate their own HBM4 development timelines.
